System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020 - Beckley, Bluefield & Lewisburg News, Weather, Sports

System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020

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SOURCE Research and Markets

DUBLIN, June 10, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/pg7cp6/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering.

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The semiconductor packaging industry in the past decade has seen the emergence of System in Package (SiP) technologies. This has been driven by the increasing demands of the portable and consumer electronics industry with greater product functionality and with improved performance at reduced costs. SiP paradigm in the electronics product execution allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, and short time-to-market. Thus, there are many wireless and consumer-focused IC and systems companies which are turning to System in Package (SiP) design to gain a competitive advantage.

One of the key players in this market include Amkor Technology (U.S.), ASE Global (Taiwan), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), ChipMOS Technologies (Taiwan), Fujitsu Semiconductor Limited (Japan), Siliconware Precision Industries Co., Ltd. (Taiwan), InsightSiP (France), Freescale Semiconductor Inc. (U.S.), Wi2Wi Inc.(U.S.), and Nanium S.A. (Portugal).

System in Package (SiP) has overcome the formidable integration barriers of heterogeneity without compromising individual chip technologies enclosed in a single module. This has given the semiconductor packaging industry a potential to revolutionize the products by manufacturing them with smaller form factor. SiP is constantly developing in automotive and medical applications due to the compact packaging technique. Thus, SiP has the ability to integrate devices and to mix technologies within a standard package footprint which has led to smaller footprints than the traditional packaging. This has reduced New Product Introduction (NPI) cycle times when compared with the System on Chip (SoC) option and has also reduced the production function level of packaging.

Key Topics Covered:

1 Introduction

2 Executive Summary

3 Market Overview

4 Market Analysis

5 Global System in Package (SIP) Market Segmentation

6 Market By Application

7 Market By Geography

8 Competitive Landscape

9 Company Profiles

Companies Mentioned:

  • Amkor Technology Inc.
  • ASE Inc.
  • Chipmos Tech. Inc.
  • Chipbond Technology Corporation
  • Fujitsu Ltd.
  • GS Nanotech
  • Insight SIP
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Nanium S.A.
  • Powertech Technologies Inc.
  • Qualcomm Incorporated
  • Siliconware Precision Industries Co., Ltd.
  • Stats Chippac Ltd.
  • Toshiba Corporation
  • WI2WI Corporation

For more information visit http://www.researchandmarkets.com/research/pg7cp6/system_in_package

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net

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